microelectronic packaging

基本解释

It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人矚目的是微電子組裝技術正在成爲現代雷達及其他電子設備中最重要的關鍵技術之一。
With the development of microelectronic packaging technologies, anisotropic conductive adhesives(ACA)are widely used as one kind of the green materials in the electronic interconnection.
隨著微電子封裝技術的發展，各曏異性導電膠作爲一種綠色的連接材料，廣泛應用於電子産品中。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就應力—應變場有限元數值模擬在微電子組裝銲點可靠性研究中的應用進行了綜述。