semiconductor bonding wafer

基本解释

Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass.
半导体硅与玻璃的静电键合技术是微电子机械系统（MEMS）的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.
晶圆键合可以使得经过抛光的半导体晶圆在不使用粘结剂的情况下结合在一起。