bond pad
基本解释
- 接合焊盘
英汉例句
- To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
为了用较小的规模模拟相对较长的金线和较大的焊盘,提出了一种温度场分析的等效方法。 - Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
钝化层(18)和聚酰亚胺层(22)将最后的 互连层(16)和接合焊盘(28)隔开。
ip.com - A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
一种半导体器件(10),具有在最后的互连层(16)和接合焊盘 之间的接触,该接合焊盘包括接合焊盘(28)和最后的互连层(16) 之间的阻挡金属(26)。
ip.com
双语例句
词组短语
- bond pad definition 焊盘图象形成
- BPP Bond Pad Pitch 及焊线区间距
- Hybrid Bond Pad Peel 混合粘结垫块剥落测量
- Non Stick On Bond Pad 第一点压不上
- Calendar pad bond paper 日历垫纸